IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
6-1437522-9STAMPED PIN |
0 |
|
Datasheet | - | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
2-1571552-6820-AG11D-ESL-LF=800 DIP GF/SN |
2,010 |
|
Datasheet | 800 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 180.0µin (4.57µm) | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 105°C |
|
820-AG11D-ESL-LFIC SOCKET, DIP20, 20 CONTACT(S), |
2,010 |
|
Datasheet | 800 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 180.0µin (4.57µm) | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 105°C |
|
|
3-1571552-2840-AG11D-ESL-LF=800 DIP GF/SN |
5,833 |
|
Datasheet | 800 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 105°C |
|
840-AG11D-ESL-LFIC SOCKET, DIP40, 40 CONTACT(S), |
5,833 |
|
Datasheet | 800 | Bulk | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 40 | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 105°C |
|
2-2129710-8CONN SOCKET LGA 3647POS GOLD |
34 |
|
Datasheet | - | Tray | Active | LGA | 3647 | - | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | - | - | - | Copper Alloy | Thermoplastic | - |
|
|
822516-3CONN SOCKET PLCC 20POS TIN |
0 |
|
Datasheet | - | Tube | Obsolete | PLCC | 20 (4 x 5) | 0.050" (1.27mm) | Tin | 100.0µin (2.54µm) | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 100.0µin (2.54µm) | Phosphor Bronze | Thermoplastic | - |
|
1825094-6CONN IC DIP SOCKET 20POS GOLD |
0 |
|
Datasheet | Diplomate DL | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 125°C |
|
|
4-1571552-8CONN IC DIP SOCKET 24POS GOLD |
0 |
|
Datasheet | 800 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 105°C |
|
524-AG11D-ESCONN IC DIP SOCKET 24POS GOLD |
0 |
|
Datasheet | 500 | Bulk | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester | -55°C ~ 105°C |
