IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
8059-2G9CONN TRANSIST TO-5 10POS GOLD |
0 |
|
Datasheet | 8059 | Bulk | Obsolete | Transistor, TO-5 | 10 (Round) | - | Gold | - | Copper Alloy | Through Hole | - | Solder | - | Gold | - | Copper Alloy | Polyamide (PA), Nylon, Glass Filled | -55°C ~ 125°C |
|
8080-1G14CONN SOCKET TRANSIST TO-3 3POS |
0 |
|
Datasheet | 8080 | Bulk | Obsolete | Transistor, TO-3 | 3 (Oval) | - | Tin-Lead | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Tin-Lead | - | Beryllium Copper | Phenolic | -55°C ~ 125°C |
|
|
3-1437504-23-1437504-2 |
130 |
|
Datasheet | 8080 | Box | Active | Transistor, TO-3 | 3 (Oval) | - | Tin-Lead | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Tin-Lead | - | Beryllium Copper | Phenolic | -55°C ~ 125°C |
|
|
2040540-1CONN SOCKET LGA 1156POS GOLD |
0 |
|
Datasheet | - | Tray | Active | LGA | 1156 (34 x 34) | 0.036" (0.91mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.039" (1.00mm) | - | - | Copper Alloy | Thermoplastic | - |
|
824-AG31DCONN IC DIP SOCKET 24POS GOLD |
0 |
|
Datasheet | 800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester | -55°C ~ 105°C |
|
|
2069965-1CONN SOCKET LGA 1155POS GOLD |
0 |
|
Datasheet | - | Bulk | Active | LGA | 1155 (40 x 40) | 0.036" (0.91mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.036" (0.91mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Thermoplastic | - |
|
8058-1G49CONN TRANSIST TO-5 8POS GOLD |
0 |
|
Datasheet | 8058 | Bulk | Obsolete | Transistor, TO-5 | 8 (Round) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Brass | Polytetrafluoroethylene (PTFE) | -55°C ~ 125°C |
|
|
8080-1G31CONN TRANSIST TO-3 3POS TIN |
0 |
|
Datasheet | 8060 | Bulk | Obsolete | Transistor, TO-3 | 3 (Oval) | - | Tin | - | Beryllium Copper | Chassis Mount | Closed Frame | Solder | - | Tin | - | Beryllium Copper | Polytetrafluoroethylene (PTFE) | -55°C ~ 125°C |
|
|
1981837-2CONN SOCKET LGA 1366POS GOLD |
0 |
|
Datasheet | - | Tray | Obsolete | LGA | 1366 (32 x 41) | 0.040" (1.02mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.040" (1.01mm) | - | - | Copper Alloy | Thermoplastic | - |
|
|
8059-2G5CONN SOCKET TRANSIST TO-5 8POS |
0 |
|
Datasheet | - | Bulk | Obsolete | Transistor, TO-5 | 8 (Round) | - | Gold | - | Copper Alloy | Through Hole | Closed Frame | Solder | - | Gold | - | Copper Alloy | Polyamide (PA), Nylon | -55°C ~ 125°C |
