IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
APH-0440-G-H

APH-0440-G-H

APH-0440-G-H

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1440-G-H

APH-1440-G-H

APH-1440-G-H

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1940-G-H

APH-1940-G-H

APH-1940-G-H

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0540-G-H

APH-0540-G-H

APH-0540-G-H

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0640-G-H

APH-0640-G-H

APH-0640-G-H

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1640-G-H

APH-1640-G-H

APH-1640-G-H

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1240-G-H

APH-1240-G-H

APH-1240-G-H

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0340-G-H

APH-0340-G-H

APH-0340-G-H

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
510-93-176-15-061001

510-93-176-15-061001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

0
RFQ
Datasheet 510 Bulk Active PGA 176 (15 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
517-83-539-20-101111

517-83-539-20-101111

CONN SOCKET PGA 539POS GOLD

Preci-Dip

0
RFQ
Datasheet 517 Bulk Active PGA 539 (20 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
APH-1832-G-H

APH-1832-G-H

APH-1832-G-H

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1432-G-H

APH-1432-G-H

APH-1432-G-H

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0932-G-H

APH-0932-G-H

APH-0932-G-H

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1932-G-H

APH-1932-G-H

APH-1932-G-H

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0832-G-H

APH-0832-G-H

APH-0832-G-H

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0332-G-H

APH-0332-G-H

APH-0332-G-H

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
517-93-223-18-098006

517-93-223-18-098006

PGA SOCK 223 PIN 18X18 SOLDER TL

Mill-Max Manufacturing Corp.

0
RFQ
Datasheet 517 Tube Active PGA 223 (18 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
145-PGM15024-40

145-PGM15024-40

CONN SOCKET PGA GOLD

Aries Electronics

0
RFQ
Datasheet PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
517-83-503-22-131111

517-83-503-22-131111

CONN SOCKET PGA 503POS GOLD

Preci-Dip

0
RFQ
Datasheet 517 Bulk Active PGA 503 (22 x 22) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
550-10-255M16-001152

550-10-255M16-001152

BGA SOLDER TAIL

Preci-Dip

0
RFQ
Datasheet 550 Bulk Active BGA 255 (16 x 16) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
Total 19086 Record«Prev1... 865866867868869870871872...955Next»
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