IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
116-43-642-41-007000

116-43-642-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ
Datasheet 116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APH-1916-G-R

APH-1916-G-R

APH-1916-G-R

Samtec Inc.

0
RFQ

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APH-0916-G-R

APH-0916-G-R

APH-0916-G-R

Samtec Inc.

0
RFQ

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APH-1416-G-R

APH-1416-G-R

APH-1416-G-R

Samtec Inc.

0
RFQ

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APH-0516-G-R

APH-0516-G-R

APH-0516-G-R

Samtec Inc.

0
RFQ

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* - Active - - - - - - - - - - - - - - -
APH-1016-G-R

APH-1016-G-R

APH-1016-G-R

Samtec Inc.

0
RFQ

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* - Active - - - - - - - - - - - - - - -
APH-1516-G-R

APH-1516-G-R

APH-1516-G-R

Samtec Inc.

0
RFQ

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* - Active - - - - - - - - - - - - - - -
APH-1116-G-R

APH-1116-G-R

APH-1116-G-R

Samtec Inc.

0
RFQ

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* - Active - - - - - - - - - - - - - - -
APH-1616-G-R

APH-1616-G-R

APH-1616-G-R

Samtec Inc.

0
RFQ

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* - Active - - - - - - - - - - - - - - -
APH-0416-G-R

APH-0416-G-R

APH-0416-G-R

Samtec Inc.

0
RFQ

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* - Active - - - - - - - - - - - - - - -
APH-1716-G-R

APH-1716-G-R

APH-1716-G-R

Samtec Inc.

0
RFQ

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* - Active - - - - - - - - - - - - - - -
123-93-324-41-801000

123-93-324-41-801000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

0
RFQ
Datasheet 123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
123-43-324-41-801000

123-43-324-41-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ
Datasheet 123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
122-13-314-41-801000

122-13-314-41-801000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

0
RFQ
Datasheet 122 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
65-PGM10008-11

65-PGM10008-11

CONN SOCKET PGA GOLD

Aries Electronics

0
RFQ
Datasheet PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
110-41-310-61-001000

110-41-310-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ

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110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-91-310-61-001000

110-91-310-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ

-

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-41-640-61-001000

110-41-640-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ

-

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
104-11-640-41-780000

104-11-640-41-780000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ
Datasheet 104 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-650-41-006000

116-93-650-41-006000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.

0
RFQ
Datasheet 116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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