IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
100-014-051

100-014-051

CONN IC DIP SOCKET 14POS GOLD

3M

0
RFQ
Datasheet 100 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Closed Frame, Seal Tape Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
130-024-050

130-024-050

CONN IC DIP SOCKET 24POS GOLD

3M

0
RFQ
Datasheet 100 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
300-032-000

300-032-000

CONN SOCKET SIP 32POS GOLD

3M

0
RFQ

-

300 - Obsolete SIP 32 (1 x 32) 0.100" (2.54mm) Gold 8.00µin (0.203µm) - Through Hole Closed Frame - 0.100" (2.54mm) Gold 8.00µin (0.203µm) - - -
400-028-000

400-028-000

CONN IC DIP SOCKET 28POS GOLD

3M

0
RFQ

-

400 - Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 8.00µin (0.203µm) - Through Hole Open Frame - 0.100" (2.54mm) Gold 8.00µin (0.203µm) - - -
130-028-050

130-028-050

CONN IC DIP SOCKET 28POS GOLD

3M

0
RFQ
Datasheet 100 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
300-014-000

300-014-000

CONN SOCKET SIP 14POS GOLD

3M

0
RFQ

-

300 - Obsolete SIP 14 (1 x 14) 0.100" (2.54mm) Gold 8.00µin (0.203µm) - Through Hole Closed Frame - 0.100" (2.54mm) Gold 8.00µin (0.203µm) - - -
400-032-000

400-032-000

CONN IC DIP SOCKET 32POS GOLD

3M

0
RFQ

-

400 - Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 8.00µin (0.203µm) - Through Hole Open Frame - 0.100" (2.54mm) Gold 8.00µin (0.203µm) - - -
110-024-050

110-024-050

CONN IC DIP SOCKET 24POS GOLD

3M

0
RFQ
Datasheet 100 Bulk Obsolete DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
500-032-000

500-032-000

CONN SOCKET SIP 32POS GOLD

3M

0
RFQ

-

- - Obsolete SIP 32 (1 x 32) 0.100" (2.54mm) Gold 8.00µin (0.203µm) - Through Hole Closed Frame - 0.100" (2.54mm) Gold 8.00µin (0.203µm) - - -
400-028-050

400-028-050

CONN IC DIP SOCKET 28POS GOLD

3M

0
RFQ
Datasheet 400 Box Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 8.00µin (0.203µm) - Through Hole Open Frame - 0.100" (2.54mm) Gold 8.00µin (0.203µm) - - -
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