IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
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30-1518-11HCONN IC DIP SOCKET 30POS GOLD |
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Datasheet | 518 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 30 (2 x 15) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
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117-43-656-41-005000CONN IC DIP SOCKET 56POS GOLD |
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Datasheet | 117 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 56 (2 x 28) | 0.070" (1.78mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.070" (1.78mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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HLS-0119-G-22.100" SCREW MACHINE SOCKET ARRAY |
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Datasheet | HLS | Tube | Active | SIP | 19 (1 x 19) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | - | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | - | Thermoplastic | -55°C ~ 140°C |
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614-87-064-08-000112CONN SOCKET PGA 64POS GOLD |
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Datasheet | 614 | Bulk | Active | PGA | 64 (8 x 8) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
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HLS-0112-G-32.100" SCREW MACHINE SOCKET ARRAY |
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Datasheet | HLS | Tube | Active | SIP | 12 (1 x 12) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | - | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | - | Thermoplastic | -55°C ~ 140°C |
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ICF-648-T-I.100" SURFACE MOUNT SCREW MACHIN |
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Datasheet | ICF | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Liquid Crystal Polymer (LCP) | -55°C ~ 125°C |
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ICA-632-SGT-L.100" SCREW MACHINE DIP SOCKET |
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Datasheet | ICA | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 10.0µin (0.25µm) | Brass | Polyester, Glass Filled | -55°C ~ 125°C |
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34-6501-20CONN IC DIP SOCKET 34POS TIN |
0 |
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Datasheet | 501 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 34 (2 x 17) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
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34-6501-30CONN IC DIP SOCKET 34POS TIN |
0 |
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Datasheet | 501 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 34 (2 x 17) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
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30-3513-10HCONN IC DIP SOCKET 30POS GOLD |
0 |
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Datasheet | Lo-PRO®file, 513 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 30 (2 x 15) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
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32-C182-11CONN IC DIP SOCKET 32POS GOLD |
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Datasheet | EJECT-A-DIP™ | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
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32-C212-11CONN IC DIP SOCKET 32POS GOLD |
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Datasheet | EJECT-A-DIP™ | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
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32-C300-11CONN IC DIP SOCKET 32POS GOLD |
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Datasheet | EJECT-A-DIP™ | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
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12-6823-90CONN IC DIP SOCKET 12POS GOLD |
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Datasheet | Vertisockets™ 800 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 12 (2 x 6) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6 | - |
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10-6810-90CONN IC DIP SOCKET 10POS GOLD |
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Datasheet | Vertisockets™ 800 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 10 (2 x 5) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole, Right Angle, Vertical | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6 | - |
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ICO-624-LGG.100" LOW PROFILE SCREW MACHINE |
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Datasheet | ICO | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Brass | Polyester, Glass Filled | -55°C ~ 125°C |
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ICF-328-SM-O.100" SURFACE MOUNT SCREW MACHIN |
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Datasheet | ICF | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Liquid Crystal Polymer (LCP) | -55°C ~ 125°C |
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ICF-328-S-I.100" SURFACE MOUNT SCREW MACHIN |
0 |
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Datasheet | ICF | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Liquid Crystal Polymer (LCP) | -55°C ~ 125°C |
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ICF-628-SM-O.100" SURFACE MOUNT SCREW MACHIN |
0 |
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Datasheet | ICF | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Liquid Crystal Polymer (LCP) | -55°C ~ 125°C |
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540-44-084-17-400004CONN SKT PLCC |
0 |
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Datasheet | 540 | Tape & Reel (TR) | Obsolete | PLCC | 84 (4 x 21) | 0.050" (1.27mm) | Tin | 150.0µin (3.81µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 150.0µin (3.81µm) | Copper Alloy | Polyphenylene Sulfide (PPS) | -55°C ~ 125°C |
