IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
144-PRS15026-12

144-PRS15026-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
Datasheet PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
145-PRS15058-12

145-PRS15058-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
Datasheet PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
145-PRS15062-12

145-PRS15062-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
Datasheet PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
145-PLS15024-12

145-PLS15024-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
Datasheet PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
145-PRS15024-12

145-PRS15024-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
Datasheet PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
132-PRS14033-12

132-PRS14033-12

PGA ZIF TEST/BURN-IN SOCKET

Aries Electronics

0
RFQ

-

PRS - Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -
32-6551-18

32-6551-18

CONN IC DIP SOCKET ZIF 32POS

Aries Electronics

0
RFQ

-

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
163-PRS15065-12

163-PRS15065-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
Datasheet PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
169-PLS17012-12

169-PLS17012-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
Datasheet PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
169-PRS17012-12

169-PRS17012-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
RFQ
Datasheet PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
Total 4131 Record«Prev1... 388389390391392393394395...414Next»
Submit BOM or RFQ Phone
+8615914913027
Email
irene@ic-flychip.net
WhatsApp
Flychip WhatsApp QR Code

Scan QR Code

Back to top