IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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8058-1G45CONN TRANSIST TO-5 8POS GOLD |
0 |
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Datasheet | 8058 | Bulk | Obsolete | Transistor, TO-5 | 8 (Round) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Brass | Polytetrafluoroethylene (PTFE) | -55°C ~ 125°C |
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8058-1G59CONN TRANSIST TO-5 3POS GOLD |
0 |
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Datasheet | 8058 | Bulk | Active | Transistor, TO-5 | 3 (Round) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Brass | Polytetrafluoroethylene (PTFE) | -55°C ~ 125°C |
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5-6437504-0CONN TRANSIST TO-3 3POS SILVER |
0 |
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Datasheet | 8080 | Bulk | Obsolete | Transistor, TO-3 | 3 (Oval) | - | Silver | - | Beryllium Copper | Chassis Mount | Closed Frame | Solder | - | Silver | - | Beryllium Copper | Diallyl Phthalate (DAP) | -55°C ~ 125°C |
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1-1747890-2CONN SOCKET LGA 771POS GOLD |
0 |
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Datasheet | - | Tray | Obsolete | LGA | 771 (33 x 33) | 0.043" (1.09mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.043" (1.09mm) | - | - | - | Thermoplastic | -25°C ~ 100°C |
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1939416-1CONN SOCKET LGA 1207POS GOLD |
0 |
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Datasheet | - | Tray | Active | LGA | 1207 (33 x 34) | 0.043" (1.09mm) | Gold | - | Beryllium Copper | Surface Mount | Closed Frame | Solder | 0.043" (1.09mm) | - | - | - | Thermoplastic | -55°C ~ 110°C |
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516-AG7DCONN IC DIP SOCKET 16POS GOLD |
0 |
|
- |
500 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | - | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | - | Copper Alloy | Polyester | -55°C ~ 125°C |
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1939416-2CONN SOCKET LGA 1207POS GOLD |
0 |
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Datasheet | - | Tray | Active | LGA | 1207 (33 x 34) | 0.043" (1.09mm) | Gold | - | Beryllium Copper | Surface Mount | Closed Frame | Solder | 0.043" (1.09mm) | - | - | - | Thermoplastic | -55°C ~ 110°C |
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2-641262-4CONN IC DIP SOCKET 16POS GOLD |
0 |
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Datasheet | Diplomate DL | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 125°C |
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1-1437538-3CONN IC DIP SOCKET 28POS TINLEAD |
0 |
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Datasheet | 800 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Tin-Lead | - | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester | -55°C ~ 105°C |
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1554116-2CONN SOCKET LGA 1356POS GOLD |
0 |
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Datasheet | - | Tray | Obsolete | LGA | 1356 (32 x 41) | 0.040" (1.02mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.040" (1.01mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Thermoplastic | -25°C ~ 100°C |
