IC Sockets

Photo	Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
	SA283000 CONN IC DIP SOCKET 28POS TIN On Shore Technology Inc.	945	0.00	RFQ	Datasheet	SA	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Tin	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Thermoplastic, Polyester, Glass Filled	-40°C ~ 105°C
	SA286040 CONN IC DIP SOCKET 28POS GOLD On Shore Technology Inc.	500	0.00	RFQ	Datasheet	SA	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	80.0µin (2.03µm)	Brass	Thermoplastic, Polyester, Glass Filled	-40°C ~ 105°C
	SA283040 CONN IC DIP SOCKET 28POS GOLD On Shore Technology Inc.	129	0.00	RFQ	Datasheet	SA	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	80.0µin (2.03µm)	Brass	Thermoplastic, Polyester, Glass Filled	-40°C ~ 105°C
	SA326000 CONN IC DIP SOCKET 32POS GOLD On Shore Technology Inc.	237	0.00	RFQ	Datasheet	SA	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Thermoplastic, Polyester, Glass Filled	-40°C ~ 105°C
	SA286000 CONN IC DIP SOCKET 28POS GOLD On Shore Technology Inc.	593	0.00	RFQ	Datasheet	SA	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Thermoplastic, Polyester, Glass Filled	-40°C ~ 105°C
	SA486040 CONN IC DIP SOCKET 48POS GOLD On Shore Technology Inc.	106	0.00	RFQ	Datasheet	SA	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	80.0µin (2.03µm)	Brass	Thermoplastic, Polyester, Glass Filled	-40°C ~ 105°C
	SA243000 CONN IC DIP SOCKET 24POS GOLD On Shore Technology Inc.	351	0.00	RFQ	Datasheet	SA	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Thermoplastic, Polyester, Glass Filled	-40°C ~ 105°C
	SA203000 CONN IC DIP SOCKET 20POS GOLD On Shore Technology Inc.	645	0.00	RFQ	Datasheet	SA	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Thermoplastic, Polyester, Glass Filled	-40°C ~ 105°C
	ED06DT CONN IC DIP SOCKET 6POS TIN On Shore Technology Inc.	470	0.00	RFQ	Datasheet	ED	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 110°C
	ED32DT CONN IC DIP SOCKET 32POS TIN On Shore Technology Inc.	879	0.00	RFQ	Datasheet	ED	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 110°C

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