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Headers, Male Pins

Mfr. Part #	Quantity	Datasheet	Series	Packaging	Product Status	Connector Type	Contact Type	Pitch - Mating	Number of Positions	Number of Rows	Row Spacing - Mating	Number of Positions Loaded	Style	Shrouding	Mounting Type	Termination	Fastening Type	Contact Length - Mating	Contact Length - Post	Overall Contact Length	Insulation Height	Contact Shape	Contact Finish - Mating	Contact Finish - Post	Contact Material	Insulation Material	Features	Current Rating (Amps)
SLV W 22 055 26 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	RFQ	Datasheet	SLV W 22 055	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	26	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.217" (5.50mm)	0.197" (5.00mm)	0.480" (12.20mm)	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 22 055 34 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	RFQ	Datasheet	SLV W 22 055	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	34	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.217" (5.50mm)	0.197" (5.00mm)	0.480" (12.20mm)	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 036 36 G pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	RFQ	Datasheet	SLV W 2 036	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	36	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.142" (3.60mm)	0.098" (2.50mm)	0.307" (7.80mm)	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 080 18 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	RFQ	Datasheet	SLV W 2 080	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	18	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.315" (8.00mm)	0.098" (2.50mm)	0.480" (12.20mm)	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 036 34 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	RFQ	Datasheet	SLV W 2 036	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	34	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.142" (3.60mm)	0.098" (2.50mm)	0.307" (7.80mm)	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 1 SMD 048 9 Z one row, wide isolation body, 4- Fischer Elektronik	RFQ	Datasheet	SLV W 1 SMD 048	Tube	Active	Header	Male Pin	0.050" (1.27mm)	9	1	-	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.189" (4.80mm)	-	-	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 22 080 8 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	RFQ	Datasheet	SLV W 22 080	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	8	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.315" (8.00mm)	0.197" (5.00mm)	0.579" (14.70mm)	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 105 62 G pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	RFQ	Datasheet	SLV W 2 105	Tube	Active	Header	Male Pin	0.050" (1.27mm)	62	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.413" (10.50mm)	0.098" (2.50mm)	0.579" (14.70mm)	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 KA 030 30 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	RFQ	Datasheet	SLV W 2 KA 030	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	30	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.118" (3.00mm)	-	-	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 036 42 G pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	RFQ	Datasheet	SLV W 2 036	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	42	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.142" (3.60mm)	0.098" (2.50mm)	0.307" (7.80mm)	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 KA 030 22 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	RFQ	Datasheet	SLV W 2 KA 030	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	22	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.118" (3.00mm)	-	-	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 130 48 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	RFQ	Datasheet	SLV W 2 130	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	48	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.512" (13.00mm)	0.098" (2.50mm)	0.677" (17.20mm)	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 22 105 50 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	RFQ	Datasheet	SLV W 22 105	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	50	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.413" (10.50mm)	0.197" (5.00mm)	0.677" (17.20mm)	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLM N 11 117 19 Z Straight, narrow insulator Fischer Elektronik	RFQ	Datasheet	SLM N 11 117	-	Active	Header	Male Pin	0.050" (1.27mm)	19	1	-	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.189" (4.80mm)	0.189" (4.80mm)	0.717" (18.20mm)	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	Narrow Insulator	1.5A
SLV W 22 080 32 G pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	RFQ	Datasheet	SLV W 22 080	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	32	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.315" (8.00mm)	0.197" (5.00mm)	0.579" (14.70mm)	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 080 24 G pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	RFQ	Datasheet	SLV W 2 080	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	24	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.315" (8.00mm)	0.098" (2.50mm)	0.480" (12.20mm)	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 105 40 G pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	RFQ	Datasheet	SLV W 2 105	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	40	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.413" (10.50mm)	0.098" (2.50mm)	0.579" (14.70mm)	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 055 12 G pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	RFQ	Datasheet	SLV W 2 055	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	12	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.217" (5.50mm)	0.098" (2.50mm)	0.382" (9.70mm)	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 055 18 G pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	RFQ	Datasheet	SLV W 2 055	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	18	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.217" (5.50mm)	0.098" (2.50mm)	0.382" (9.70mm)	0.067" (1.70mm)	Square	Gold	Gold	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A
SLV W 2 KA 030 60 Z pitch 1.27 x 2.54 mm; suitable f Fischer Elektronik	RFQ	Datasheet	SLV W 2 KA 030	Bulk	Active	Header	Male Pin	0.050" (1.27mm)	60	2	0.100" (2.54mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.118" (3.00mm)	-	-	0.067" (1.70mm)	Square	Tin	Tin	Copper Zinc	Polyamide (PA46), Nylon 4/6, Glass Filled	-	1.5A

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