FFC, FPC (Flat Flexible) Connector Assemblies

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Flat Flex Type Mounting Type Connector/Contact Type Number of Positions Pitch Termination FFC, FCB Thickness Height Above Board Locking Feature Cable End Type Contact Material Contact Finish Housing Material Actuator Material Features Voltage Rating Operating Temperature Material Flammability Rating
FF0270SS1

FF0270SS1

CONN FPC BOTTOM 70POS 0.3MM R/A

JAE Electronics

0
RFQ
Datasheet FF02 Tray Obsolete FPC Surface Mount, Right Angle Contacts, Bottom 70 0.012" (0.30mm) Solder 0.12mm 0.047" (1.20mm) Flip Lock Straight Copper Alloy Gold Liquid Crystal Polymer (LCP) Polyphenylene Sulfide (PPS) Zero Insertion Force (ZIF) 50V -40°C ~ 85°C UL94 V-0
FF0871SA1-R300

FF0871SA1-R300

CONN FPC BOTTOM 71POS 0.2MM R/A

JAE Electronics

0
RFQ
Datasheet FF08 Tape & Reel (TR) Obsolete FPC Surface Mount, Right Angle Contacts, Bottom 71 0.008" (0.20mm) Solder 0.15mm 0.039" (1.00mm) Flip Lock Tabbed Copper Alloy Gold Plastic Plastic Zero Insertion Force (ZIF) 50V -40°C ~ 85°C UL94 V-0
FF0290SS1

FF0290SS1

CONN FPC BOTTOM 90POS 0.3MM R/A

JAE Electronics

0
RFQ
Datasheet FF02 Tray Obsolete FPC Surface Mount, Right Angle Contacts, Bottom 90 0.012" (0.30mm) Solder 0.12mm 0.047" (1.20mm) Flip Lock Straight Copper Alloy Gold Liquid Crystal Polymer (LCP) Polyphenylene Sulfide (PPS) Zero Insertion Force (ZIF) 50V -40°C ~ 85°C UL94 V-0
FA5B006HP1R3000

FA5B006HP1R3000

Interconnect Circular

JAE Electronics

0
RFQ

-

FA5 Bulk Active FPC Board Edge, Cutout Contacts, Bottom 6 0.020" (0.50mm) Solder 0.30mm 0.057" (1.45mm) Flip Lock - Copper Alloy Tin Liquid Crystal Polymer (LCP), Glass Filled Polyamide (PA), Nylon, Glass Filled Solder Retention, Zero Insertion Force (ZIF) - -40°C ~ 85°C UL94 V-0
FB10S025JT1R6000

FB10S025JT1R6000

Interconnect Rectangular

JAE Electronics

0
RFQ

-

FB10 Bulk Active FPC Surface Mount, Right Angle Contacts, Bottom 25 0.012" (0.30mm) Solder 0.20mm 0.035" (0.88mm) Flip Lock Tapered Phosphor Bronze Gold Plastic Plastic Zero Insertion Force (ZIF) 50V -40°C ~ 85°C UL94 V-0
FA5B016HP1R3000

FA5B016HP1R3000

Interconnect Circular

JAE Electronics

0
RFQ

-

FA5 Bulk Active FPC Board Edge, Cutout Contacts, Bottom 16 0.020" (0.50mm) Solder 0.30mm 0.057" (1.45mm) Flip Lock - Copper Alloy Tin Liquid Crystal Polymer (LCP), Glass Filled Polyamide (PA), Nylon, Glass Filled Solder Retention, Zero Insertion Force (ZIF) - -40°C ~ 85°C UL94 V-0
FA5B020HP1

FA5B020HP1

CONN FPC BOTTOM 20POS 0.5MM SMD

JAE Electronics

0
RFQ
Datasheet FA5 Tray Obsolete FPC Board Edge, Cutout Contacts, Bottom 20 0.020" (0.50mm) Solder 0.30mm - Flip Lock Tapered Copper Alloy Gold Liquid Crystal Polymer (LCP), Glass Filled Polyamide (PA), Nylon, Glass Filled Solder Retention, Zero Insertion Force (ZIF) 50V -40°C ~ 85°C UL94 V-0
FA5B030HP1

FA5B030HP1

CONN FPC BOTTOM 30POS 0.5MM SMD

JAE Electronics

0
RFQ
Datasheet FA5 Tray Obsolete FPC Board Edge, Cutout Contacts, Bottom 30 0.020" (0.50mm) Solder 0.30mm - Flip Lock Tapered Copper Alloy Gold Liquid Crystal Polymer (LCP), Glass Filled Polyamide (PA), Nylon, Glass Filled Solder Retention, Zero Insertion Force (ZIF) 50V -40°C ~ 85°C UL94 V-0
FA5B050HP1

FA5B050HP1

CONN FPC BOTTOM 50POS 0.5MM SMD

JAE Electronics

0
RFQ
Datasheet FA5 Tray Obsolete FPC Board Edge, Cutout Contacts, Bottom 50 0.020" (0.50mm) Solder 0.30mm - Flip Lock Tapered Copper Alloy Gold Liquid Crystal Polymer (LCP), Glass Filled Polyamide (PA), Nylon, Glass Filled Solder Retention, Zero Insertion Force (ZIF) 50V -40°C ~ 85°C UL94 V-0
FA5S006HP1

FA5S006HP1

CONN FPC BOTTOM 6POS 0.5MM R/A

JAE Electronics

0
RFQ
Datasheet FA5 Tray Obsolete FPC Surface Mount, Right Angle Contacts, Bottom 6 0.020" (0.50mm) Solder 0.30mm 0.057" (1.45mm) Flip Lock Tapered Copper Alloy Gold Liquid Crystal Polymer (LCP), Glass Filled Polyamide (PA), Nylon, Glass Filled Solder Retention, Zero Insertion Force (ZIF) 50V -40°C ~ 85°C UL94 V-0
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